PCB Service

Over the last decade, XPCB Ltd has grown from a green hand to an expert in the EMS industry. The investment put in talent and advanced production equipment go up from million to hundred millions to enhance our production capability and efficiency. 

It is always a nerve-wracking job to select a qualified vendor, especially for complex and hi-tech products like PCB.  Price, quality, and lead time usually serve as key metrics to measure a vendor. But if digging deeper, the capability would be the factor largely impact above 3 metrics.

Rigid PCB Capability

Layer Count

2-56 Layers

Laminate

FR-4, High TG, Halogen-free, High-speed, High- frequency

Min Trace/Space

2mil/2mil

Min Hole

Laser-drilled 0.075mm

Max Size

546mm X 622mm

Final Thickness

0.3mm-3.5mm

Finish Treatment

 HASL/Lead-Free HASL/OSP

Immersion Au/Immersion Tin /ENIG/ENEPIG

Advanced Technology
Buried Capacitance\Buried resistance\Copper & Epoxy Filled Vias
Back drilling\Board edge Gold-cladded
Sequential Lam & Stacked Vias

Flexible PCB Capability

Layer Count

1-12 Layers

Min Trace/Space
2mil/2mil
Min Hole

Laser drilling: 3mil

Mechanical drilling: 4mil

Laminate

Polyimide

DuPont™ Kapton®
DuPont™ Pyralux®
Panasonic FELIOS®
Max Size
20″x40″
Final Thickness
0.12-0.4 mm
Finish Treatment

LF HASL, OSP, ENIG, Immersion tin, Gold fingers

Stiffener Material

8 Layer FPC Standard Stackup

Rigid-flex PCB Capability

Layer Count

2-26 Layers

Laminate

Polyimide, FR-4

Min Trace/Space

3mil/3mil

Min Hole

5mil

Max Size

500 x 1000mm

Final Thickness

0.2mm- 7mm

Finish Treatment

ENIG, Imm Tin, Imm Ag, OSP, Gold Finger

Min Hole Ring

5mil

HDI PCB Capability

Layer

2-20 Layer

1-4 tiers & anylayer

Min Trace/Space

2mil/2mil

Min Hole
2.5mil
Max Size
609.6 * 889 mm
Final Thickness

0.3mm-3.5mm

Finish Treatment

 HASL/Lead-Free HASL/OSP

Immersion Au/Immersion Tin /ENIG/ENEPIG

Advanced Technology

 Microvia, Blind via & buried vias

Stepping vias

High-frequency PCB Capability

Layer Count

2-20 Layers

Laminate
Min Trace/Space

2mil / 2mil

Min Hole

Laser-drilled 0.075mm

Max Size

546mm X 622mm

Final Thickness

0.3mm-3.5mm

Finish Treatment

 HASL/Lead-Free HASL/OSP

Immersion Au/Immersion Tin /ENIG/ENEPIG

Quality Standard

IPC II, IPC III, RoHs

Build Your PCB Right at One-Time