Processing materials play a vital role in the quality and production efficiency of SMT chip processing. When designing SMT chips and establishing production lines, appropriate process materials must be selected according to the process flow and process requirements. The smt processing materials include welding and patch materials such as solder, solder paste, adhesive, and process materials such as flux, cleaning agent, and heat transfer medium.
1. Solder and solder paste
Solder is an important structural material in the SMT chip process. Different types of solder are used in different applications, which are used to connect the metal surfaces of the objects to be soldered and form solder joints. Reflow soldering uses solder paste, which is the solder material and at the same time pre-fixes the SMC/SMD with its viscosity.
Flux is an important process material in chip processing. It is one of the key factors affecting the welding quality, and it is required in various welding processes, and its main function is to flux.
Adhesive is the bonding material in SMT patches. When the wave soldering process is used, the components are generally pre-fixed on the PCB with an adhesive. When the SMD is assembled on both sides of the PCB, even if reflow soldering is used, the adhesive is often applied to the center of the PCB land pattern to strengthen the fixation of the SMD and prevent the SMD from shifting and falling during the assembly operation.
4. Cleaning Agent
The cleaning agent is used in SMT patches to clean the residue left on the board after the soldering process. Under the current technical conditions, cleaning is still an indispensable part of the patch process, and solvent cleaning is the most effective cleaning method.
SMT processing materials are the basis of the patch process, and the corresponding assembly process materials are selected for different assembly processes and assembly processes.
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