Ceramic substrate refers to copper foil at high temperature directly bonded to aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double) special process plate. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing property and high adhesion strength, and can etch all kinds of graphics just like PCB board, with great current carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology.
At present, the FR-4 circuit board is widely used in the market, but the FR-4 circuit board defect is irreversible.
The technical staff of XPCB Ltd. made a simple analysis of the circuit boards on the market with their years of experience in making circuit boards.
So the question is, what is the value of ceramic PCB? It is analyzed from the following three aspects:
In these aspects, ceramic PCB can achieve the current top. Its thermal conductivity is the best among THE PCB at present, and its thermal expansion coefficient is more compatible with the silicon chip, with very low dielectric constant, excellent electrical conductivity, corrosion resistance, high-temperature resistance, and small loss at high frequency.
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We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.
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