The most critical factor in maintaining PCB etching equipment is to ensure the high cleanliness of the nozzle and no obstructions, so that the nozzle can spray smoothly. Blockage or slagging will cause pressure to impact the surface of the plate during the injection. If the nozzle is not clean, the etching will be uneven and the entire circuit board will be scrapped.
Obviously, the maintenance of the equipment is to replace the damaged and worn parts. Since the nozzle also has the problem of wear and tear, the nozzle should be included in the replacement.
In addition, the more critical issue is to keep the etching machine free of slag. Because in many cases, too much slag accumulation will affect the chemical balance of the etching solution.
Likewise, if the etchant is chemically unbalanced, the slag will become more severe. When a large amount of slagging occurs suddenly in the etching solution, it is usually a signal that there is a problem with the balance of the solution. At this time, strong hydrochloric acid should be used for proper cleaning or supplementation of the solution.
In addition, the residual film will also produce slag. A very small amount of residual film is dissolved in the etching solution to form copper salt precipitation. This means that the previous film removal process is not complete, and the poor film removal is often the result of the combination of edge film and over-plating.
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