For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. The reliability of the electronic equipment performance will decrease. Therefore, it is very important to conduct a good heat dissipation treatment on PCB.
1. Add heat-dissipating copper foil and copper foil with large area power supply.
Thermal vias can effectively reduce the junction temperature of the device, improve the uniformity of the temperature in the thickness direction of the single board, and provide the possibility to adopt other heat dissipation methods on the back of the PCB. Through simulation, it is found that compared with non-thermal vias, thermal vias with a thermal power consumption of 2.5W, a pitch of 1mm and a center design of 6×6 can reduce the junction temperature by about 4.8°C. While the temperature difference between the top and bottom of the PCB Reduced from the original 21°C to 5°C. After the thermal via array is changed to 4×4, the junction temperature of the device has increased by 2.2°C compared with 6×6, which is worthy of attention.
3. The copper is exposed on the back of the IC to reduce the thermal resistance between the copper skin and the air.
4. PCB layout.
Requirements for high-power and thermal-sensitive devices.
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