PCB Service

Over the last decade, XPCB Ltd has grown from a green hand to an expert in the EMS industry. The investment put in talent and advanced production equipment go up from million to hundred millions to enhance our production capability and efficiency. 

Rigid PCB Capability

rigid pcb capability
Layer Count
2-56 Layers
Min Trace/Space

2mil/2mil

Min Hole

Laser-drilled 0.075mm

Mechanical: 0.2mm

Laminate

FR-4, High TG, Halogen-free, High-speed, High- frequency

Min Annular Ring

50um

Max Size

546mm X 622mm

Final Thickness

0.3mm-3.5mm

Finish Treatment

 HASL/Lead-Free HASL/OSP

Wire Bondable Gold/Hard Gold

Immersion Au/Immersion Tin /ENIG/ENEPIG

Advanced Technology

Buried Capacitance\Buried resistance\Copper & Epoxy Filled Vias

Back drilling\Board edge Gold-cladded

Sequential Lam & Stacked Vias

Flexible PCB Capability

Layer Count

1-12 Layers

Min Trace/Space

2mil/2mil

Min Hole

Laser drilling: 3mil

Mechanical drilling: 4mil

Laminate

Polyimide

DuPont™ Kapton® & Pyralux®
Panasonic FELIOS®

Max Size

20″x40″

Soldermask & Coverlay

Soldermask:Green,Black,Red,White,Blue 

Coverlay:Yellow,Black,White

Final Thickness

0.12-0.4 mm

Finish Treatment

LF HASL, OSP, ENIG, Immersion tin, Gold fingers

Stiffener Material

FR-4, SUS, Polyimide

Rigid-flex PCB Capability

Layer Count

2-26 Layers

Materials: Dupont AP8535,AP8545; Panasonic RF775, RF777,

Feature

Gold finger, Tented via, blind &buried via, Impedance control, Carbon ink, Peelable mask / Kapton, countersink, BGA

Min Trace/Space

3mil/3mil

Min Hole

5mil

Max Size

500 x 1000mm

Soldermask/Coverlay

Soldermask:Green,Black,Red,White,Blue 

Coverlay:Yellow,Black,White

Final Thickness

0.2mm- 7mm

Finish Treatment

ENIG, Imm Tin, Imm Ag, OSP, Gold Finger,

Min Hole Ring

5mil

HDI PCB Capability

Layers

2-20 Layer

1-4 tiers & anylayer

Min Trace/Space

2mil/2mil

Min Hole

2.5 mil

Max Size
609.6 * 889 mm
Final Thickness

0.3mm-3.5mm

Finish Treatment

 HASL/Lead-Free HASL/OSP

Immersion Au/Immersion Tin /ENIG/ENEPIG

Advanced Technology

 Microvia, Blind via & buried vias

Stepping vias

High-frequency PCB Capability

Layer Count

2-20 Layers

Laminate
Min Trace/Space

2mil / 2mil

Min Hole

Laser-drilled 0.075mm

Mechanical hole: 0.2mm

Max Size

546mm X 622mm

Max Size

546mm X 622mm

Final Thickness

0.3mm-3.5mm

Finish Treatment
Quality Standard

IPC II, IPC III, RoHs