PCB Blog

2021-09-16

How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 4)

4. Adopt the method of mixing high and low solder paste In fact, XPCB Limited does not recommend this method, because the solder strength of low-temperature […]

2021-09-16

How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 3)

In addition, because the furnace carrier needs to withstand the high temperature of repeated reflow soldering many times, it is generally made of metal material or […]

2021-09-16

How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 2)

Another type of dispensing operation will be on the side of the part. This can only be done after the solder paste is printed and the […]

2021-09-15

How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 1)

With the rapid development of mobile phone technology, EMS in mainland China has reported serious shortages of labor from time to time. Secondly, Industry 4.0 has […]