Effective Measures to Reduce The Cost of Printed Circuit Board Manufacturing (1)

Effective Measures to Reduce The Cost of Printed Circuit Board Manufacturing

1. The impact of printed circuit board size design on cost

The original size of the copper clad plate is too large, it is inconvenient to process, and sometimes it cannot be put into the printed circuit board processing equipment for processing, so it needs to be cut into several pieces of copper clad plate of processing size first. As for the specific size of the processing size, it needs to be determined according to the processing equipment for making the printed circuit board, the size of each printed circuit board, and some process parameters. In addition to the length and width required by the printed circuit pattern, these process parameters also include the width consumed by the screw holes for fixing the printed circuit board on the electronic product frame, the process allowance for shape processing, electroless plating, electroplating and corrosion. The clamping allowance of the fixture, the positioning pin allowance of the multilayer printed circuit board, the alignment mark allowance between layers, the mark allowance of the printed circuit board manufacturer, the side width of the printed circuit board, etc., among which some recommended values ​​of process parameters can be obtained from copper clad laminate manufacturers or distributors. During the production and processing of printed circuits, the above data can be used to determine how many copper-clad sheets of processing size are cut from a large original-size copper-clad sheet, whether it is longitudinally or transversely cut, whether it can be cut or not, and so on.

2.The impact of the number of layers of printed circuit boards on the cost

With the increase in the number of layers of printed circuit boards, the production cost will increase sharply, so there may be a large difference in cost due to a single thought. If you encounter difficulties in designing a 6-layer printed circuit board, you must not give up lightly, perhaps a large amount of economic benefits is in your persistent efforts. When encountering such a thing, in most cases, the designer may choose to design an 8-layer printed circuit without hesitation.

3. CEM-3 material

In addition to the widely used double-sided epoxy resin glass cloth copper-clad plate for double-sided printed circuit boards, there is also a low-cost CEM-3 material whose structure is to combine the original double-sided ring thick epoxy resin glass cloth used as the base material in the oxygen resin glass cloth copper-clad plate is changed into two very thin sheets. At this time, due to insufficient strength, epoxy resin glass cloth is sandwiched between the two thin sheets of epoxy resin glass cloth. Plexiglas non-woven fabric, thus reducing the cost. The CEM-3 material is soft in texture and can be used as a core material for multi-layer rigid printed circuit boards in addition to being used alone.