Three Methods of Disassembling Integrated Circuits

What are the methods for complete disassembly of an integrated circuit?

1. Solder Suction Disassembly Method

It is a common professional method to disassemble the integrated block by using a tin suction device. When disassembling the integrated block, just put the heated dual-purpose soldering iron tip on the pins of the integrated block to be disassembled, and after the solder joints are melted, they will be sucked into the tin absorber. Blocks can be easily removed.

2. Internal Thermal Desolder Removal Method

When using, first squeeze the rubber ball, place the tin tip on the solder collection tube on the unsoldering point, and after the solder melts, loosen the rubber ball, and the solder is sucked into the collection tube. Then remove the electric soldering iron from the unsoldering point, squeeze the rubber ball, and spray the solder in the collecting cylinder from the tin suction head.

3. Medical Hollow Core Needle Disassembly Method

Look for a few 8-12-gauge hollow core needles for medical use. When using them, the inner diameter of the needles is just enough to cover the pins of the manifold. When disassembling, use a soldering iron to melt the solder on the pins, and cover the pins with needles in time. Then remove the soldering iron and rotate the pin, wait for the solder to solidify and then pull out the pin so that the pin is completely separated from the board. All pins are done as above, and the integrated block can be easily removed.