PCBs With High Density And Refinement, Four Types of Products Are Most Concerned (2)

Integrating component PCB while embedding active and passive components is the way out.

With the development and progress of high-density electronic products, high-frequency signal transmission and high-speed digitalization, the increase in the number of chip I/Os and the rapid increase in the number of passive components have increasingly affected the reliability and transmission of electronic products. For signal integrity, the way out is to integrate (embedded) component printed boards.

Development steps: embedded passive components (mainly capacitors, resistors and inductors, etc.) – → integrated (embedded) active components (IC components).

1. Embedded Passive Components

The number of passive components is rapidly increasing. The number of passive components will increase rapidly with the increase of IC component integration (or I/O number), high-frequency signal transmission and high-speed digitization (the assembled active components/passive components will increase from 1:10—→ 1:20—→1:30—→1:50). Passive components occupy more and more board area (30%→40%→50%→70%), which affects high density. The number of soldering points of passive components is also more and more. It affects the reliability of the connection, because solder joints are one of the main failures of electronic products.

The increase of passive components will inevitably bring problems. The increase of passive components has made more and more solder joints, and the reliability of soldering has become lower and lower. Soldering joints have always been the largest failure rate of electronic products. The electromagnetic interference generated by the loop formed by passive components is becoming more and more serious. The increase of passive components and the increase of board size (area), etc., have an adverse effect on the performance of high-frequency and high-speed digital transmission.

The use of embedded passive components can eliminate these effects and significantly improve the integrity and reliability of the transmitted signal.

The embedded passive components can be divided into embedded single passive components, embedded “integrated” (combination of capacitors, resistors, etc.) passive components.

2. Embedded Active Components

At the same time of embedding passive components, it is also embedding active components (various IC components), which is under development and trial, and is the road of future development.

Rigid-flexible printed boards will grow faster in the future

In 2006, the output value of flexible (including rigid-flexible) printed boards accounted for 17% of the total output value of PCBs, and there will be a rapid increase in the future. By 2010, it is expected to reach 25%-30%.

The structure of rigid-flex printed boards can be various.

The advantages of rigid-flex printed boards are many, but the most important is increased reliability in high-density connections (replacement of mechanical connectors, etc.); conducive to miniaturization; installation flexibility (bending or folding) and implementation Three-dimensional (3D) assembly; simplified installation process and maintenance; convenient post-processing, etc. These have obvious advantages. Therefore, it will develop with the development of miniaturization, high performance, and multi-functionalization of electronic products.