What are the technical development characteristics of HDI multilayer boards? Knowing this will help us to study the requirements for the performance of its substrate materials in the development of technology, and find the basis and entry point for judgment. The technological development of HDI multilayer boards has the characteristics of innovation, diversification of process methods, strong practicability, and close relationship with the progress of material technology. Its strong dependence on materials is its outstanding feature. The development of HDI always complements and progresses together. Whether it is the advent of various HDI multilayer board processes, or the improvement of its quality and level, it is all closely related to the technical support of the substrate materials it uses. Since the advent of HDI multilayer boards, high-performance copper clad laminates have basically progressed and developed around the greater development of HDI multilayer board technology. Its impact on the development of high-performance copper clad laminate technology is mainly reflected in the following aspects: the diversification of substrate material product forms, the multi-variety of a class of CCL products, the specialization of CCL products by manufacturers, the pursuit of a balanced CCL performance, CCL rapid introduction of new products.
The epoxy resin industry adapts to the development of high-performance copper clad laminate technology is a hot spot in the industry. The rapid development of HDI multilayer boards drives the development of high-performance copper clad laminates in the direction of diversified product forms, multiple varieties, specialization of manufacturers’ products, balanced performance, and rapid product development.
What strategies should the epoxy resin industry take to deal with the development of high-performance copper clad laminates?
First, we must develop serialized epoxy resin products to adapt to the diversification and variety of CCL. Second, we must change roles, from “Coordination” (cooperating with the CCL industry to develop new products) is transformed into “integration” (participating in the development of new products in the CCL industry. Thirdly, it is necessary to not only study the body resin, but also study the resin composition system suitable for CCL, including curing agent, curing accelerator, diluent, Other compounding agents, etc., and further research should be carried out on the modification technology of epoxy resin, compatibility and reactivity with other high-performance polymer resins, and interface bonding technology with other materials (reinforcing materials, filler materials, etc.). Fourth, CCL manufacturers develop characteristic brand products, which are based on developing and mastering the unique technology for manufacturing CCL product resin compositions. As an epoxy resin manufacturer, they are assisting downstream CCL manufacturers to promote this resin composition. In the development work of CCL, epoxy resins with special performance requirements corresponding to the CCL products developed by some CCL manufacturers should be developed. The demand for epoxy resin varieties will increase more and more. It will develop the cooperation chain between the resin supply factory and the CCL factory more closely.
The current key development issues of substrate materials and epoxy resins corresponding to the technological progress of HDI multilayer boards. The development of HDI multi-layer board technology in the next few years will focus on the width/pitch of the conductive circuit will be finer, the via hole will be finer, and the insulating layer of the substrate will be thinner. This development trend has put forward the following two important issues for the substrate material manufacturing industry. How to ensure the reliability of substrate insulation and reliable through-holes in the case of the continuous development of narrow spacing and microporation of HDI multilayer boards. performance. How to achieve thinner profile of high-performance CCL. The first aspect of the subject is the reliability of substrate materials, which is determined by the basic properties of CCL (including heat resistance, ion migration resistance, moisture resistance, TCP resistance, dielectric properties, etc.), electroplating processability), the comprehensive performance of the two aspects, and the specific properties of the CCL mentioned are related to the performance of the CCL resin. The so-called correlation with the resin means that the epoxy resin should meet the requirements of three layers: to achieve the required performance indicators for the resin; to ensure the stability of these properties under some changes in conditions; to coexist with other high-performance resins Good properties (ie mutual solubility, or reactivity, or good polymer alloying properties).
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