Introduction For The Blind Hole PCB Manufacturing Process

1. Process:

The buried orifice plate is the same as the common double plate. Blind orifice plate, i.e. one side is outer:

Positive film process: single side D/F should be done, pay attention not to roll the wrong side (when the copper on both sides is inconsistent); During D/F exposure, the copper surface should be covered with black tape to prevent light transmission.

Because the blind hole plate is made more than twice, the finished product is easy to be super thick. Therefore, the drawing should pay attention to the thickness of the control plate and the thickness of the copper plate. After etching, the range of the thickness of the copper plate should be indicated. After pressing the plate, use X-Ray machine to punch the target hole for the multilayer plate.

Negative film process: for thin plate (< 12mil copper > can not be produced in the diagram electric drawing, it must be produced in the water Jin pull, and the water Jin pull can not be divided into the current, so it can not be made in one side according to the requirements of MI no current or low current. Such as the positive process, often lead to single-side copper thick ultra thick, resulting in etching difficulties, thin line phenomenon, so this kind of plate need to go negative process.

2. The drilling sequence of through hole and blind hole is different, and the deviation during production is not consistent. Blind hole plate is easy to produce deformation, and it is difficult to control the alignment of multi-layer plate and the distance between tube positions when opening material, so only open transverse material or only open straight material when opening material.

3. Laser drill

Laser DRILL is a blind hole, which has its own characteristics:

Aperture size: 4 — 6 mil

PP thickness must < =4.

5mil, calculated according to aspect ratio < = 0.75:1

There are three kinds of PP: LDPP 106 1080; FR4 106 1080; RCC.

4. How to define the buried hole plate with resin plug hole

1. H1 (CCL) : H2 (PP) > =4 thickness ratio
2. Li (CCL) 32 MIL
3. 2OZ and above 2OZ laser buried hole plate;High thickness copper, high TG plate to use resin sealing hole.

This kind of board anderanged process should pay attention to the first resin sealing and then do the line so as not to cause greater damage to the line.