Six Common Methods for Removing Tin in Circuit Board Processing? （Part 2）

5. Add solder melting and disassembly method
This method is a labor-saving method, as long as some solder is added to the pins of the integrated block to be disassembled so that the solder joints of each column of pins are connected, so as to facilitate heat transfer and facilitate disassembly. When disassembling, use an electric soldering iron to heat each column of pins with sharp tweezers or a small “one” screwdriver to pry, and the two columns of pins are heated alternately until they are removed. Under normal circumstances, each column of pins can be removed by heating them twice.

6. Tin suction disassembly method of multi-strand copper wire
It is to use multiple strands of copper core plastic wire to remove the plastic sheath and use multiple strands of copper core wire (short thread ends can be used). Before use, put the rosin alcohol solution on the multiple copper core wires. After the electric soldering iron is heated, put the multiple copper core wires on the pins of the integrated block and heat them, so that the solder on the pins will be absorbed by the copper wires. The upper part of the solder can be cut off, and the solder on the pins can be completely sucked away by repeating it several times. The braided wire in the shielded wire can also be used if possible. As long as the solder is sucked up, use tweezers or a small “one” screwdriver to gently pry, and the integrated block can be removed.

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