- rosin joint caused by equipment factors
1)The machine moves too fast in the PCB transmission and positioning, and cause the displacement of heavier components
2)The SPI solder paste detector and AOI testing equipment did not detect the related solder paste coating and placement problems in time
- rosin joint caused by design factors
1)The size of the pad and the component pin does not match
2)rosin joint caused by metallized holes on the pad
- rosin joint caused by operator factors
1)Abnormal operation during PCB baking and transfer, causing PCB deformation
2)Illegal operations in the processing