Solder Mask Operation of PCB Production Process

The Role of PCB:

The function of PCB is to provide a base for completing the first-level assembly of components and other necessary electronic circuit board parts to form a module or finished product with specific functions. Therefore, in the entire electronic product, the PCB plays the role of integrating and connecting all the functions of the assembly. So the PCB is often the first to be questioned when the function of the electronic product fails.

The evolution of PCB：

As early as 1903, Mr. Albert Hanson pioneered the use of the concept of “Circuit” to be applied to the telephone exchange system. It is cut into circuit conductors with metal foil and glued to paraffin paper, which is also pasted with a layer of paraffin paper, which has become the prototype of the current PCB mechanism. By 1936, Dr Paul Eisner truly invented the PCB manufacturing technology and issued a number of patents. Today’s print-etch (photo image transfer) technology is inherited from its invention.

PCB types and manufacturing methods are diversified in materials, levels, and production processes to suit different electronic products and their special needs.

PCB Double Layers:

Cutting, drilling, copper plating, plate surface plating, pattern transfer, pattern plating, etching, quality inspection, printing solder mask (green oil/white characters), immersion gold, tin spray, gold plating, V-CUT gong, beer house test FQC packaging finished product warehouse shipment

PCB Multilayer Board:

PCB types and manufacturing methods are diversified in materials, levels, and production processes to suit different electronic products and their special needs.

PCB copper surface treatment (brushing)

Printing ink (screen printing ink has different meshes, generally 77T or 57T)

Pre-baked (different ink parameters are different, generally 75-80 degrees)

Exposure (exposure energy level 10-12)

Development (55% development point)

Visual inspection

Post curing (150 degrees 60 minutes)

The PCB production process is divided into several aspects, divided into single-panel process, double-panel process, and multi-layer board process. In addition to the general hard board, the soft board is also a flexible board FPC. There are also several processes, such ad single-layer FPC, multi-layer FPC, etc.