In today’s PCB processing, the reason why we promote hybrid assembly services is because it starts with surface mount technology (SMT), which is the main stage trend after through-hole insertion technology (THT) in the OEM process. In addition to SMT and plated through-hole technology, we have also used many other operations, such as implementing heat sinks, cables and press-fit connectors, supporting PTH I/0 communications, etc. These are the advantages of mixing.
The layout stage plays a vital role in mixed assembly placement. We gradually use design for manufacturability (DFM) for hybrid model assembly in the layout phase. Our core considerations follow the following factors to obtain accurate mixed assembly placement:
Reduce the total number of components in the product:
Reducing product components requires less processing time, development time, equipment, smt processing difficulty, service inspection, testing, etc.
The modular layout increases the versatility of the product, simplifies the redesign process and helps minimize product changes.
We use multifunctional layout components:
In addition to their main functions, some layout components also have self-alignment functions, which facilitate the effective layout of modules for mixed assembly placement.
In order to facilitate the PCB mixed assembly process, choose the best combination of layout and materials. With the ease of manufacturing, the problems of excessive tolerances and surface finish requirements will be minimized. This is also the major advantage of the whole mixed process.
XPCB Limited is a premium PCB & PCBA manufacturer based in China.
We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.
Quick-turn PCB prototyping is our specialty. Demanding project is our advantage.
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