Method Two 1: Import the layer file, check, arrange, align, etc., and then rename the two outer layers to fronrear. Rename the inner layer to ily02, […]

At present, PCB products have begun to move from traditional to higher-density HDI/BUM boards, IC packaging base (carrier) boards, embedded component boards and rigid-flex boards, and […]

Integrating component PCB while embedding active and passive components is the way out. With the development and progress of high-density electronic products, high-frequency signal transmission and […]

In the process of PCB subcontracting and material processing, the selection of PCB through tin is very important. In the through-hole plug-in process, if the tin […]