In the process of SMT patch processing and production, auxiliary materials such as patch glue, solder paste, and steel mesh are often used. These auxiliary materials play a vital role in product quality and production efficiency in the entire SMT assembly and production process.
1. Shelf Life
The storage time during which a material or product can still meet technical requirements and maintain proper performance under specified conditions.
2. Working Time
SMD adhesive and solder paste can keep the specified chemical and physical properties for the longest time when exposed to a specified environment before use.
Adhesive properties of drop ductility of chip adhesive and solder paste during natural dripping.
4. Thixotropy Ratio
SMD adhesive and solder paste have fluid properties when extruded under pressure, and quickly become solid after extrusion or stop applying pressure. This property is called thixotropy.
After the solder paste is printed, the height is reduced and the bottom area exceeds the specified boundary due to the action of gravity and surface tension, temperature rise or excessive parking time.
The distance that the patch glue spreads at room temperature after dispensing.
7. Adhesion (Tack)
The size of the adhesion of solder paste to components and the change of its adhesion with the storage time of solder paste after printing.
The state in which molten solder forms a uniform, smooth and non-fractured thin layer of solder on the copper surface.
9. No-clean Solder Paste
Solder paste that contains only traces of harmless flux residue after soldering without cleaning the PCB.
10. Low Temperature Paste
Solder paste with melting temperature below 163°C.
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