What is a blind via PCB circuit board?
The so-called blind hole circuit board refers to the hole that is not drilled, the difference between a blind hole and a through hole is that the through hole is the hole that is drilled through all layers, and the blind hole is drilled before pressing, and the through hole is drilled after pressing.
What basic knowledge do you need to know to make blind-hole PCB circuit boards?
(1) Drill belt: Select through hole as the unit reference hole, each blind hole drill belt needs to select a hole, identify its corresponding unit reference hole coordinates, and note which drill belt corresponds to which layers, when the laser hole and the inner layer of the buried hole together, even if the hole of the two drill strips is in the same position, it is also necessary to confirm with the customer, move the position of the laser hole to ensure the electrical connection, can not be arbitrarily dealt with by experience.
(2) Tooling holes: The inner layer of the ordinary multi-layer board does not need to be drilled, only when making blind hole circuit boards, all tooling holes of blind hole boards are drilled, and the edge of the production panel needs to be drilled to distinguish each board.
(3) Film modification: Remark that the film produces a positive and negative film, the plate thickness is greater than 8mil (without copper) and the positive film process is taken, and the negative film process is less than 8mil (without copper), and the copper thickness at d/f should be considered when the line thickness/line gap valley is large, rather than the bottom copper thickness.
(4) Production process: The only difference between the blind hole plate and the buried through hole is that one side is in the outer layer, and it is necessary to do single-sided D/F and pay attention not to turn the wrong surface (when the double-sided bottom copper is inconsistent); When D/F is exposed, the bright copper surface is covered with black tape to prevent light transmission, because the blind hole plate is on the surface of the plate and the other is on the inner layer.
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