Characteristics of Microporous Materials for PCB Board Processing

The micro-hole characteristics of PCB board can be used for high-density packaging on traditional multilayer board materials such as FR-4. Microvias are used in multilayer boards to realize interlayer interconnection for the surface circuit layers added. The number of micro-holes on the printed boards ranges from less than 100 to thousands.

According to the characteristics described above, although the microvias are relatively fragile, in fact the interconnection between these layers is extremely strong, which makes them suitable for consumer electronic products such as video cameras, digital cameras and mobile phones.

As a class of materials for PCB circuit board prototyping, these materials are mainly semi-cured sheets or liquid unreinforced polymers. When fully cured, these materials generally have a glass transition temperature above 160°C and non-photosensitive imaging liquid and film non-woven aromatic polyamide laminates, excellent moisture resistance and chemical resistance.

The expansion performance in the z-direction is similar to other epoxy resins and acrylates with similar glass transition temperatures. Because there is no need for reinforcing materials such as glass fiber cloth, the microporous materials of pcb circuit board processing manufacturers are suitable for various hole processing methods such as laser, plasma or photodeveloping processes. The processing depth of the hole can be accurately controlled to the target pad.

XPCB Limited is a manufacturer specializing in the production of high-precision double-sided, multi-layer and impedance, blind buried vias, and thick copper circuit boards. The products cover HDI, thick copper, backplanes, rigid-flex combined, buried capacitance and buried resistance, golden finger and other kinds of circuit boards, which can meet the needs of customers for all kinds of products.