The most commonly used material for printed circuit boards in metallized hole circuit board factories is epoxy-glass cloth. Its dimensional stability is suitable for high-density circuit use, and it can minimize the occurrence of cracks in metallized holes. Its fairly good dimensional stability and availability in the semi-cured prepreg stage also make it the most suitable type of material for the circuit structure of rigid multilayer printed circuit board factories.
One disadvantage of epoxy-glass cloth laminate is that it is difficult to punch in the usual thickness range of printed boards in circuit board factories. For this reason, all holes are usually drilled and the imitation milling operation has formed the appearance of the printed board.
In mechanical applications, the temperature resistance of printed board materials of various levels of circuit board factories will vary to a certain extent with the thickness of the material.
Although the manufacturing process or the arrangement of the conductor patterns can cause warpage or distortion of the etched printed board, it is more often caused during the manufacture of the copper clad laminate.
Designers can minimize this effect in two ways:
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