Epoxy CCL is an important and high-performance application field of epoxy resin. Discussing and studying the performance requirements of high-performance copper clad laminates for the epoxy resin used in them should be observed and analyzed from the perspective of the entire industry chain, especially from the main performance requirements of the development of HDI multilayer boards for high-performance CCL. What are the development characteristics of HDI multi-layer boards and what is its development trend? These are the basic basis for the development trend and focus of high-performance CCL we want to study. The technological development of HDI multilayer boards is driven by the development of its application market—terminal electronic products. At present, high-performance CCL and HDI boards continue to put forward new requirements for the performance of epoxy resins.
First, it can be analyzed from the impact of the development characteristics of HDI multilayer boards on the technological progress of high-performance copper clad laminates. The advent of 1HDI multilayer board is a serious challenge to traditional PCB technology and its substrate material technology. In the early 1990s, the earliest development results of a new generation of high-density interconnection (High Density Interconnection, referred to as HDI) printed circuit boards – Build-Up Multiplayer printed board (referred to as BUM), its advent is a major event in the development of printed circuit board technology in the world for decades. Laminated multi-layer boards, namely HDI multi-layer boards, are still the best and most common product form for developing HDI PCBs. On top of HDI multi-layer boards, the latest PCB (epoxy printed circuit board) cutting-edge technology is applied. manifested incisively and vividly.
HDI multilayer board product structure has three prominent features. Mainly: “micro holes, thin lines, thin layers”. Among them, “micropore” is the core and soul of its structural characteristics. Therefore, this type of HDI multilayer board is now called “microplate”. HDI multi-layer board has experienced more than 10 years of development, but it is still full of vigor and vitality in technology, and there is still a bright future in the market. When challenging the traditional PCB technology and its substrate material technology, it also changes the thinking of CCL product development and leads the development trend of today’s CCL technology. As the main “source power” of today’s CCL technology innovation, it promotes the rapid development of CCL technology.
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