Printed circuit boards must continuously consume various substances in the solution during the electroless copper plating process. During the operation, according to the production volume, they should be analyzed and tested in time, supplemented in time, to maintain the stability of the solution.
With the continuation of production, the electroless copper plating solution is used repeatedly. Frequent addition of chemical substances will gradually increase various impurities in the solution. Part of the old solution should be replaced after a certain production period to increase the activity of the electroless copper plating solution. To ensure the quality of the electroless copper layer.
When the electroless copper plating work is over, dilute sulfuric acid can be used to adjust the pH value below 10, and filter the particulate matter in the solution in time after the reaction of the electroless copper plating solution stops. When it is to be reused, first use dilute alkali to slowly adjust the pH value to the process range under constant stirring.
In short, whether it is electroless thin copper plating or electroless thick copper plating, the electroless copper plating solution should be prepared correctly according to the process specifications; strictly control the process conditions; carefully maintain the electroless copper plating solution; strengthen the front and Post-processing. These are the keys to the final quality assurance of the product.
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