What is the OSP process? What are the advantages of choosing the OSP process for PCB? Here is a detailed answers to these questions.
With the rapid development of electronic circuit technology, PCB circuit board processing technology is also rising linearly. The surface treatment process of the circuit board includes lead-free tin spray, anti-oxidation OSP, immersion gold, gold plating, and electro-gold. Today we will explain in detail the OSP type PCB circuit board. (OSP multilayer circuit board processing manufacturer)
OSP material types: Rosin, Active Resin and Azole. The OSP material used is currently the most widely used azole OSP.
What is OSP?
1. OSP is a group English abbreviation: Organic Solder ability PreservATIve), multi-layer circuit boards are called organic solder-ability preservatives, also called heat-resistant pre-solders, and in the circuit board industry, they are called antioxidants. (Commonly known as antioxidant)
2. OSP composition: The general ingredients are: alkylbenzimidazole, organic acid, copper chloride and deionized water.
Advantages of OSP
1. Thermal stability, when compared with FLUX, which is also a surface treatment agent, it is found that after OSP is reheated at 235°C, there is no oxidation on the surface and the protective film is not damaged. Take two samples of OSP and FLUX respectively, and put them in a 60℃, 90% constant temperature and humidity box. After one week, the OSP sample has no obvious change, while the FULX sample surface has a small $ Oxidize after heating.
2. The management is simple. The OSP process is relatively simple and easy to operate. The client can use any welding method to process it without special treatment; in the circuit production, there is no need to consider the problem of surface uniformity, and no need to Worry about the concentration of the liquid, simple and convenient management method, foolproof operation method.
3. Low cost. Because it only reacts with the bare copper part to form a non-sticky, thin and uniform protective film, the cost per square meter is lower than other surface treatment agents. It can be said that it is compared with all surface treatment processes. The cheap one.
4. Reduce pollution, OSP (OSPPCB circuit board) does not contain harmful substances that directly affect the environment, such as lead and lead compounds, bromine and bromine compounds, etc., in the automatic production line, the working environment is good, and the equipment requirements are not high.
5. It is convenient for downstream manufacturers to assemble and use OSP (OSPPCB circuit board) for surface treatment. The surface is smooth. When printing solder paste or pasting SMD components on metal-clad multilayer circuit boards, it reduces the deviation of parts and reduces the possibility of empty soldering of SMD solder joints. (OSP multilayer circuit board processing manufacturer)
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