How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 3)

In addition, because the furnace carrier needs to withstand the high temperature of repeated reflow soldering many times, it is generally made of metal material or special high-temperature resistant plastic. There is also a special reminder that using Carrier will require an additional labor cost. Putting the board on the carrier requires labor, and the recycling and reuse of the vehicle also requires labor.

Secondly, the use of the carrier may cause the risk of deterioration of the tin melting condition, because the furnace carrier is usually made of metal, and the area is large and easy to absorb heat, which will cause the risk of difficulty in temperature rise, so when you adjust the furnace temperature, you must It must be measured together with the furnace carrier, and the carrier should try to steal the unused meat, as long as the carrier is sufficiently supported and not deformed as a principle.

3. Adjust the temperature difference between the upper and lower furnaces of the reflow furnace

The reflow furnace can usually control the upper and lower furnace temperature. The early electronic parts are still in the age of 1206. When adjusting the reflow furnace, we usually adjust the lower furnace temperature to 5-10°C less than the upper furnace temperature. , The purpose is to hope that when the second side is reflowed, the parts that have been welded on the first side will not fall due to remelting tin, but now most SMT engineers do not adjust the furnace temperature in this way, because the parts are very small. There is no risk of falling.