• +86-755-23012705
  • Building 3, Jinfeng Industrial Park, Fuyong Street, Baoan District, Shenzhen ,China
  • [email protected]
logo
  • Home
  • About Us
    • Flexible PCB Expertise
    • Our Certifications
    • Our Facility
    • Quality Assurance
  • PCB Fabrication
    • Flexible PCB
    • Rigid Flex PCB
    • Rigid PCB
    • ELIC HDI PCB
    • RF PCB
    • Medical PCB
    • Automotive PCB
    • IoT & IIoT PCB
    • Industrial Control PCB
    • Telecommunication PCB
    • Consumer Electronics PCB
  • PCB Assembly
    • Turn Key PCB Assembly
    • Consigned PCB Assembly
    • Components Sourcing
  • Capabilities
    • PCB Fab Capability
    • ATE PCB Fabrication
    • PCB Technology Roadmap
    • PCB Assembly Services
    • PCB Design Support
  • Contact
  • Resources
    • PCB Blog
    • PCB Glossary
  • Home
  • About Us
    • Flexible PCB Expertise
    • Our Certifications
    • Our Facility
    • Quality Assurance
  • PCB Fabrication
    • Flexible PCB
    • Rigid Flex PCB
    • Rigid PCB
    • ELIC HDI PCB
    • RF PCB
    • Medical PCB
    • Automotive PCB
    • IoT & IIoT PCB
    • Industrial Control PCB
    • Telecommunication PCB
    • Consumer Electronics PCB
  • PCB Assembly
    • Turn Key PCB Assembly
    • Consigned PCB Assembly
    • Components Sourcing
  • Capabilities
    • PCB Fab Capability
    • ATE PCB Fabrication
    • PCB Technology Roadmap
    • PCB Assembly Services
    • PCB Design Support
  • Contact
  • Resources
    • PCB Blog
    • PCB Glossary
Get Quote

How to Choose the Power Chip When Designing PCB?

In PCB design, it is required to select DC / DC or LDO for power chip design.

How to choose the power chip when designing PCB?

1、 Simply put, in the case of boost, only DC / DC can be used, because LDO is voltage drop type and cannot boost.

Selection of LDO

When the designed circuit has the following requirements for shunt power supply.

  1. High noise and ripple suppression;
  2. Small PCB area, such as mobile phones and other handheld electronic products;
  3. The circuit power supply does not allow the use of inductors, such as mobile phones;
  4. The power supply needs to have instantaneous calibration and output state self-checking functions;
  5. The voltage stabilizer is required to have low voltage drop and low power consumption;
  6. Low line cost and simple scheme are required;

At this time, LDO is the most appropriate choice to meet various requirements of product design.

 

  1. We need to look at their main characteristics.

DC/DC: High efficiency and high noise; the advantage is that the conversion efficiency is high, and the current can be large, but the output interference is large, and the volume is relatively large.

LDO: low noise, low quiescent current; small size, less interference, when the input and output voltage difference is larger, the conversion efficiency is low.

Therefore, if it is used in the case of a relatively large voltage drop, choose DC/DC because of its high efficiency, and the LDO will lose a large part of its efficiency due to the large voltage drop.

If the voltage drop is relatively small, choose LDO because of its low noise, clean power supply, simple peripheral circuits and low cost.

LDO is a low dropout regulator, which means a low dropout linear regulator, which is relative to the traditional linear regulator. Traditional linear regulators, such as 78xx series chips, require the input voltage to be higher than the output voltage by more than 2V~3V, otherwise it will not work properly. But in some cases, such conditions are obviously too harsh, such as 5v to 3.3v, the pressure difference between input and output is only 1.7v, which obviously does not meet the conditions. In response to this situation, there is an LDO type power conversion chip.

LDO Linear Step-Down Chip: The principle is equivalent to a resistor divider to achieve a step-down. The energy loss is large, and the dropped voltage is converted into heat. The greater the pressure difference and load current of the step-down, the more obvious the chip heats up. The package of this type of chip is relatively large, which facilitates heat dissipation.

LDO linear step-down chips such as 2596, L78 series and so on.

DC/DC Step-Down Chip: In the step-down process, the energy loss is relatively small, and the chip heating is not obvious. The chip package is relatively small and can realize PWM digital control.

DC/DC step-down chips such as TPS5430/31, TPS75003, MAX1599/61, TPS61040/41.

Generally speaking, in PCB design, DCDC must be selected for step-up, and whether DCDC or LDO is selected for step-down should be compared in terms of cost, efficiency, noise and performance. The key is specific application and specific analysis.

Share

Related posts

dispensing in PCB
2025-02-07

Multilayer PCB Assembly and HDI PCB Manufacturing for High-Tech Solutions


Read more
smt product line
2025-02-06

Streamline Your PCB Production with XPCB’s Turnkey PCBA Services


Read more
2025-02-05

Comprehensive Turnkey PCBA Services: From BOM to SMT Assembly


Read more
amazon
amphenol-logo
halliburton
intel logo
samtec logo
sanmina logo

Company Info

XPCB Limited is a premium PCB & PCBA manufacturer based in China.

We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.

Quick-turn PCB prototyping is our specialty.  Demanding project is our advantage.

Head Office

XPCB Limited
Address :
Building 3, JinFeng Industry Area,  Fuyong Town, Baoan District, Shenzhen, Guangdong, 518103, China.

Tel : +86-136-3163-3671
Fax : +86-755-2301 2705
Email : [email protected]

Quick Links

  • Flexible PCB
  • Rigid Flex PCB
  • ELIC HDI PCB
  • RF PCB
  • PCB Capability
  • PCBA Capabiility
  • About Us

PCB Blog

Multilayer PCB Assembly and HDI PCB Manufacturing for High-Tech Solutions

Read More »

Streamline Your PCB Production with XPCB’s Turnkey PCBA Services

Read More »

Comprehensive Turnkey PCBA Services: From BOM to SMT Assembly

Read More »

© 2024 - XPCB Limited All Right Reserve