• +86-755-23012705
  • [email protected]
  • Building 3, Jinfeng Industrial Park, Fuyong Street, Baoan District, Shenzhen ,China
Search
Close
logo
  • Home
  • About Us
    • About XPCB
    • Flexible PCB Fabrication
    • PCB Fab Capability
    • PCBA Capability
    • Our Certifications
    • Our Facility
    • Quality Assurance
  • PCB Fabrication
    • Flexible PCB
    • Rigid Flex PCB
    • Rigid PCB
    • ELIC HDI PCB
    • RF PCB
    • Medical PCB
    • Automotive PCB
    • IoT & IIoT PCB
    • Industrial Control PCB
    • Telecommunication PCB
    • Consumer Electronics PCB
  • PCB Assembly
    • Turn Key PCB Assembly
    • Consigned PCB Assembly
    • Components Sourcing
  • Resources
    • PCB Glossary
    • PCB Design Guide
    • PCB Blog
  • Contact
Menu
  • Home
  • About Us
    • About XPCB
    • Flexible PCB Fabrication
    • PCB Fab Capability
    • PCBA Capability
    • Our Certifications
    • Our Facility
    • Quality Assurance
  • PCB Fabrication
    • Flexible PCB
    • Rigid Flex PCB
    • Rigid PCB
    • ELIC HDI PCB
    • RF PCB
    • Medical PCB
    • Automotive PCB
    • IoT & IIoT PCB
    • Industrial Control PCB
    • Telecommunication PCB
    • Consumer Electronics PCB
  • PCB Assembly
    • Turn Key PCB Assembly
    • Consigned PCB Assembly
    • Components Sourcing
  • Resources
    • PCB Glossary
    • PCB Design Guide
    • PCB Blog
  • Contact
Get Instant Quote

Introduction For The Blind Hole PCB Manufacturing Process

  1. Process:

 

The buried orifice plate is the same as the common double plate. Blind orifice plate, i.e. one side is outer:

 

Positive film process: single side D/F should be done, pay attention not to roll the wrong side (when the copper on both sides is inconsistent); During D/F exposure, the copper surface should be covered with black tape to prevent light transmission.

 

Because the blind hole plate is made more than twice, the finished product is easy to be super thick. Therefore, the drawing should pay attention to the thickness of the control plate and the thickness of the copper plate. After etching, the range of the thickness of the copper plate should be indicated. After pressing the plate, use X-Ray machine to punch the target hole for the multilayer plate.

 

Negative film process: for thin plate (< 12mil copper > can not be produced in the diagram electric drawing, it must be produced in the water Jin pull, and the water Jin pull can not be divided into the current, so it can not be made in one side according to the requirements of MI no current or low current. Such as the positive process, often lead to single-side copper thick ultra thick, resulting in etching difficulties, thin line phenomenon, so this kind of plate need to go negative process.

 

  1. The drilling sequence of through hole and blind hole is different, and the deviation during production is not consistent. Blind hole plate is easy to produce deformation, and it is difficult to control the alignment of multi-layer plate and the distance between tube positions when opening material, so only open transverse material or only open straight material when opening material.

 

  1. Laser drill

 

Laser DRILL is a blind hole, which has its own characteristics:

Aperture size: 4 — 6 mil

PP thickness must < =4.

5mil, calculated according to aspect ratio < = 0.75:1

There are three kinds of PP: LDPP 106 1080; FR4 106 1080; RCC.

 

  1. How to define the buried hole plate with resin plug hole

 

  1. H1 (CCL) : H2 (PP) > =4 thickness ratio
  2. Li (CCL) 32 MIL
  3. 2OZ and above 2OZ laser buried hole plate;High thickness copper, high TG plate to use resin sealing hole.

 

This kind of board anderanged process should pay attention to the first resin sealing and then do the line so as not to cause greater damage to the line.

 

Share

Related posts

2022-05-20

Electromagnetic Compatibility Design of Mobile Phone PCB (1)


Read more
2022-05-20

The PCB Circuit Design of LED Switching Power Supply


Read more
2022-05-20

Electromagnetic Compatibility Design of Mobile Phone PCB (2)


Read more
amazon
amphenol-logo
halliburton
intel logo
samtec logo
sanmina logo
Previous
Next

Company Info

XPCB Limited is a premium PCB & PCBA manufacturer based in China.

We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.

Quick-turn PCB prototyping is our specialty.  Demanding project is our advantage.

Head Office

XPCB Limited
Address :
Building 3, JinFeng Industry Area,  Fuyong Town, Baoan District, Shenzhen, Guangdong, 518103, China.

Tel : +86-136-3163-3671
Fax : +86-755-2301 2705
Email : [email protected]

Quick Links

  • Flexible PCB
  • Rigid Flex PCB
  • ELIC HDI PCB
  • RF PCB
  • PCB Capability
  • PCBA Capabiility
  • About Us

PCB Blog

Electromagnetic Compatibility Design of Mobile Phone PCB (1)

Read More »

The PCB Circuit Design of LED Switching Power Supply

Read More »

Electromagnetic Compatibility Design of Mobile Phone PCB (2)

Read More »

© 2023 - XPCB Limited All Right Reserve