Introduction For The PCB Repeated Review Problem

With the high-speed development of electronic products, PCB production in the extensive use of BGA, QFP, PGA and CSP contour integration device, the complexity of the PCB also greatly increased, resulting in PCB design and manufacture of hard, difficult test, welding, production problems, such as device mismatch and maintenance difficulties, lead to the entire product delays, product repair rate is high.

 

Do you often encounter the following questions in product development:

 

▪ Improper component selection and PCB design defects lead to multiple revisions of the scheme;

PCB review is not passed, constantly change the board, back to the factory to make the board again;

▪ Multiple revisions and validation of the design lead to extended product development cycles, increased costs, and poor quality and reliability;

 

The traditional electronic product development process, usually design, manufacturing and sales stages, is usually completed in succession.

The details generally include:

1. Pre-preparation, including device selection and schematic diagram design;
2. PCB structure design, determine the size of the board, the mechanical positioning;
3. PCB layout and wiring, considering the layout of components, optimize the electrical performance of wiring and circuit;
4. PCB machining inspection, network, DRC inspection and structural inspection to ensure that all machining parameters meet the process requirements;
5. Sample production, batch processing, on-site problem inspection

.

 

In the design stage, many hardware engineers and PCB engineers often do not fully consider the manufacturable requirements, coupled with the lack of process knowledge, problems are found in the production process, leading to more rework and repeated validation of boards, or worse effects.

 

In the product life cycle, the most important link is design and manufacturing. A mature engineer should make special discussion and review on PCB manufacturability (DFM) from the requirement analysis stage.

Are you also encountering:

 

▪ Design PCB cannot be produced due to overproduction process

▪ Not able to use design or CAM software, unable to view blueprints

 

Nor know:

 

How can PCB typesetting be more cost-effective

▪ PCB Impedance Design How to Be More Accurate

▪ How to make PCB design more production-friendly

If I lack design experience and have limited resources, how can I do DFM analysis well?

Identify and resolve problems early in the product life cycle

 

I recommend you use XPCB