Processing materials play a vital role in the quality and production efficiency of SMT patch processing. When designing SMT patches and establishing a production line, appropriate process materials must be selected according to the process flow and process requirements. The SMT processing materials include solder, solder paste, adhesives and other welding and patch materials, as well as flux, cleaning agents, heat conversion media and other process materials.
1. Solder and solder paste
Solder is an important structural material in the SMT chip process. Different types of solder are used in different applications, which are used to connect the metal surface of the welded object and form a solder joint. Reflow soldering uses solder paste, which is a soldering material, and at the same time can use its viscosity to pre-fix the SMC/SMD.
Flux is an important process material in chip processing. It is one of the key factors that affect the quality of welding. It is needed in various welding processes, and its main function is to assist welding.
Adhesive is the bonding material in SMT patches. When using the wave soldering process, an adhesive is generally used to pre-fix the components on the PCB. When assembling SMD on both sides of the PCB, even if reflow soldering is used, adhesive is often applied to the center of the PCB land pattern to strengthen the fixation of the SMD and prevent the SMD from shifting and falling during the assembly operation.
4. Cleaning agent
The cleaning agent is used in the SMT patch to clean the residue left on the board after the soldering process. Under current technical conditions, cleaning is still an indispensable part of the placement process, and solvent cleaning is the most effective cleaning method. SMT processing materials are the basis of the placement process, and the corresponding assembly process materials are selected for different assembly processes and assembly procedures. Sometimes in the same assembly process, the materials used are also different due to different subsequent processes or different assembly methods.
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