Micro-Assembly Technology Analysis of SMT Chip Processing

The micro-assembly technology of SMT chip processing is actually a comprehensive technology that uses micro welding and SMT chip processing to assemble various micro components that make up electronic circuits on high-density multilayer interconnection substrates to form microelectronic products.

1. Multi-Chip Module

The multi-chip component in the PCBA package is a high-tech electronic product derived from the hybrid integrated circuit. This technology assembles multiple LSI and VLSI chips on a hybrid multi-layer interconnect substrate at high density, and then packaged into housing, it is a highly hybrid integrated component. The MCM chip interconnection assembly technology of SMT chip processing is to assemble components and devices on the MCM substrate in a specific connection method, and then install the substrate of the assembled components in the package to form a multi-functional MCM component. The MCM chip interconnection assembly technology includes: the bonding of the chip and the substrate, the electrical connection between the chip and the substrate, the physical connection and the electrical connection between the substrate and the housing.

2. Flip-Chip FC Technology

The flip-chip technology of SMT chip processing is to realize the interconnection between the chip and the circuit board through the bumps on the chip. Generally, the chip is placed on the circuit board in reverse. Gold wire bonding technology generally uses the surrounding part of the chip, while the flip-chip solder bump technology uses the entire chip surface, which can make the packaging density of the flip-chip technology higher and reduce the size of the device. Flip-chip technology in PCBA packaging materials includes: solder paste flip-chip assembly process, solder stud bump flip-chip bonding method, and controlled collapse connection C4 technology.

3. Package Stacking

The emergence of PoP stacking assembly technology in PCBA contracting materials has blurred the boundaries between primary packaging and secondary assembly, not only improving logic operation functions and storage space, but also providing end users with the possibility of freely choosing device combinations. Controlled production costs. The main function of the PoP package is to integrate high-density digital or mixed-signal logic devices in the bottom package, and integrate high-density or combined memory devices in the top package.

4. Photoelectric Interconnection Technology

4.1 Photoelectric board-level packaging
SMT chip processing is to integrate optoelectronic devices and electronic packaging to form a new board-level package. This board-level package can be regarded as a special multi-chip module that contains optical circuit substrates, optoelectronic devices, optical waveguides, optical fibers, optical connectors and other devices.

4.2 Optoelectronic components and modules
Optoelectronic components and modules are optoelectronic circuit components or modules formed by optoelectronic packaging technology, which can make copper conductors for transmitting electrical signals and optical paths for transmitting optical signals on a substrate.

3. Hierarchical structure of optical circuit assembly
Optical circuit assembly is generally composed of 6 layers. Chip level, device level, MCM level, board level, component level, system level.