Precautions for Graphic Etching of PCB Boards

When etching, must adhere to the first piece of processing. Determine the etching parameters (rate, temperature, etc.) through the first piece processing, and determine whether the pattern accuracy and line width of the processed board meet the requirements after etching. After the first piece of etching has passed the inspection, batch processing will be carried out.

The etching section is equipped with inspection tools one by one scale microscope to strengthen the inspection before and after etching. Use a scale microscope to check the microstrip line width on the board before and after etching, find problems in time, and improve the quality of processing and inspection.

For the pattern with denser wires, it should be consistent with the transmission direction of the etching machine to prevent the accumulation of etching solution on the PCB board surface, and during etching, the denser side of the wires should face down, and the sparser side of the wires should face up. It can improve the uniformity of etching on both sides of the printed circuit pattern.

During the etching process, the etching machine should be checked at any time to check the spraying status of the nozzles, pay attention to whether the nozzles are blocked, and whether the conveyor belt is running normally, so as to prevent mechanical failures, scratch lines and waste boards during etching.