In the layout of the flexible circuit board, when the circuit board size is too large, although the soldering is easier to control, the printed lines are long, the impedance increases, the anti-noise ability decreases, and the cost increases; if it is too small, the heat dissipation decreases, and the soldering is difficult to control, and adjacent lines interfere with each other will occur often, such as the electromagnetic interference of the circuit board. Therefore, the PCB board design must be optimized:
(1) Shorten the wiring between high-frequency components and reduce EMI interference.
(2) Components with heavy weight (such as more than 20g) should be fixed with brackets and then welded.
(3) Heat dissipation issues should be considered for heating components to prevent defects and rework caused by large ΔT on the surface of the components, and the thermal components should be far away from the heating source.
(4) The arrangement of components should be as parallel as possible, so that it looks tidy and also easy to weld, and will be suitable for mass production. The circuit board is designed as a 4:3 rectangle (good). Do not change the wire width to avoid wiring discontinuities. When the circuit board is heated for a long time, the copper foil is prone to swell and fall off. Therefore, avoid using large-area copper foil.
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