Matters needing attention when baking:
For SMD (SOP, SOJ, PLCC, QFP, etc.) packed in plastic tubes, the packaging tube is not resistant to high temperature and cannot be directly put in the oven for baking.
It should be placed in a metal tube or metal tray for baking.
QFP’s packaging plastic tray has two types: non-high temperature resistant and high temperature resistant.
High temperature resistant (with Tmax=135°C, 150°C, or 180°C) can be directly put into the oven for baking, and those that are not resistant to high temperature can not be directly put into the oven to bake to prevent accidents and should be placed separately Bake in a metal pan.
The pins should be prevented from being damaged during transfer, so as not to damage the working surface.
Requirements when picking up SMT components
During transportation, material separation, inspection or manual mounting, if the staff needs to take SMT devices, they should wear an anti-static wrist strap, try to use a suction pen to operate, and pay special attention to avoid bumping the pins of SOP, QFP and other devices. Prevent pin warping and deformation.
How to save the remaining SMD
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