Quality Assurance (Part 2)

IQC Incoming Inspection
Measure the thickness of PCB
Check whether the through-holes of the PCB and ink are blocked, etc.
Check whether the PCB is warped and deformed, and the silkscreen is clear
Check whether the PCB has defects such as broken wires and jumpers
Place the PCB in the reflow soldering for furnace temperature test to check whether it is yellow or deformed
Check whether the batch number, part number, and silkscreen of the incoming electronic components are consistent with the BOM
Incoming electronic components are placed on the bare PCB board for pad or through-hole adaptation test
Sampling check the resistance and capacitance of incoming electronic components and compare them with the BOM
Check whether there are scratches, deformations, broken feet, short feet, etc. on the surface of the incoming electronic components

Component Storage and Solder Paste Printing
Store sensitive components in a professional constant temperature and humidity box
For some strict PCB/IC/BGA bake for 48-72 hours to remove surface moisture and enhance solderability
Adopt first-line brand solder paste
Open high-quality laser steel mesh
Complete solder paste freezing, thawing, and mixing procedures
Equipped with a fully automatic solder paste printer to ensure the consistency and reliability of solder paste printing during mass production

SMT Chip Processing
Adopt Samsung SM471/481/482, series high-speed automatic SMT placement machine, with an accuracy of 01005
Equipped with the electric feeder to reduce the throwing rate and failure warning probability
Support mainstream chip types, such as QFN, SOP, SOT, TSOP, QFP, BGA, PLCC
The maximum capacity of a single machine of SM471 is 75,000 pieces per hour
Equipped with 20 temperature zone reflow soldering, set qualified furnace temperature curve
Use the furnace temperature tester to detect and record the furnace temperature every 4 hours
Use AOI optical detector to batch detect wrong parts, missing parts, reverse, false welding, and other defects
Use x-Ray to prepare a board with dense ball BGA

DIP Plug-in Processing
Strict work instructions
Develop wave soldering jigs for mass production to ensure the reliability and consistency of soldering
Use well-known brand wave soldering
Equipped with 2 plug-in production lines to meet mass production needs
The engineering department develops a test rack according to customer requirements and is capable of completing programming and functional testing of mainstream chips