the Advanced Technology of PCB Multilayer Circuit Board (Part 2)

2. Thermosetting ink layering technology (referred to as TCD technology) 　　

TCD technology is a new technology for making SBU layer in HDI board by using silk-printing thermosetting ink and then performing full-board electroless copper deposition instead of pressing board. 　　

The advantages of TCD technology are: 　　

A. The dielectric thickness of the SBU layer is adjustable.  The thickness of the dielectric layer required by the user needs to be printed with the thick thermosetting ink instead of being restricted by the fixed thickness of the semi-solid sheet. 　　

B. Laser drilling is easy to achieve.  Because the main component of the ink is resin and does not contain glass, compared to the epoxy glass cloth in the prepreg, the laser energy required is lower and more stable, so laser drilling is easy to control. 　　

C. The manufacturing cost is greatly reduced. Because laser drilling glass cloth technology is difficult to control, some manufacturers first use copper foil with semi-cured resin (RCC for short) that does not contain glass cloth for pressing. This kind of RCC is only produced in Japan and is expensive, so the use of TCD technology can achieve the same effect without using RCC. 　　

D. Simplify the production process. Laser drilling can be used directly after printing the ink in the TCD process. If other materials such as RCC are used, a copper window must be opened at the position to be drilled on the board before laser drilling can be carried out. 

As a professional FPC soft board manufacturer, XPCB Limited is so honored to have worked together with many of you. At XPCB Limited we are always more than ready to assist our new customers in any way we can.  Please feel free to contact us at any time if you have any questions.