• +86-755-23012705
  • Building 3, Jinfeng Industrial Park, Fuyong Street, Baoan District, Shenzhen ,China
  • [email protected]
Search
Close
logo
  • Home
  • About Us
    • About XPCB
    • Flexible PCB Fabrication
    • PCB Fab Capability
    • PCBA Capability
    • Our Certifications
    • Our Facility
    • Quality Assurance
  • PCB Fabrication
    • Flexible PCB
    • Rigid Flex PCB
    • Rigid PCB
    • ELIC HDI PCB
    • RF PCB
    • Medical PCB
    • Automotive PCB
    • IoT & IIoT PCB
    • Industrial Control PCB
    • Telecommunication PCB
    • Consumer Electronics PCB
  • PCB Assembly
    • Turn Key PCB Assembly
    • Consigned PCB Assembly
    • Components Sourcing
  • Resources
    • PCB Glossary
    • PCB Design Guide
    • PCB Blog
  • Contact
Menu
  • Home
  • About Us
    • About XPCB
    • Flexible PCB Fabrication
    • PCB Fab Capability
    • PCBA Capability
    • Our Certifications
    • Our Facility
    • Quality Assurance
  • PCB Fabrication
    • Flexible PCB
    • Rigid Flex PCB
    • Rigid PCB
    • ELIC HDI PCB
    • RF PCB
    • Medical PCB
    • Automotive PCB
    • IoT & IIoT PCB
    • Industrial Control PCB
    • Telecommunication PCB
    • Consumer Electronics PCB
  • PCB Assembly
    • Turn Key PCB Assembly
    • Consigned PCB Assembly
    • Components Sourcing
  • Resources
    • PCB Glossary
    • PCB Design Guide
    • PCB Blog
  • Contact
Get Instant Quote

the Advanced Technology of PCB Multilayer Circuit Board (Part 2)

2. Thermosetting ink layering technology (referred to as TCD technology)   

TCD technology is a new technology for making SBU layer in HDI board by using silk-printing thermosetting ink and then performing full-board electroless copper deposition instead of pressing board.   

The advantages of TCD technology are:   

A. The dielectric thickness of the SBU layer is adjustable.  The thickness of the dielectric layer required by the user needs to be printed with the thick thermosetting ink instead of being restricted by the fixed thickness of the semi-solid sheet.   

B. Laser drilling is easy to achieve.  Because the main component of the ink is resin and does not contain glass, compared to the epoxy glass cloth in the prepreg, the laser energy required is lower and more stable, so laser drilling is easy to control.   

C. The manufacturing cost is greatly reduced. Because laser drilling glass cloth technology is difficult to control, some manufacturers first use copper foil with semi-cured resin (RCC for short) that does not contain glass cloth for pressing. This kind of RCC is only produced in Japan and is expensive, so the use of TCD technology can achieve the same effect without using RCC.   

D. Simplify the production process. Laser drilling can be used directly after printing the ink in the TCD process. If other materials such as RCC are used, a copper window must be opened at the position to be drilled on the board before laser drilling can be carried out. 

As a professional FPC soft board manufacturer, XPCB Limited is so honored to have worked together with many of you. At XPCB Limited we are always more than ready to assist our new customers in any way we can.  Please feel free to contact us at any time if you have any questions.

Share

Related posts

2023-05-31

The Future of Wearable Technology: Rigid-Flex PCB


Read more
2022-05-20

Electromagnetic Compatibility Design of Mobile Phone PCB (1)


Read more
2022-05-20

The PCB Circuit Design of LED Switching Power Supply


Read more
amazon
amphenol-logo
halliburton
intel logo
samtec logo
sanmina logo
Previous image
Next image

Company Info

XPCB Limited is a premium PCB & PCBA manufacturer based in China.

We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.

Quick-turn PCB prototyping is our specialty.  Demanding project is our advantage.

Head Office

XPCB Limited
Address :
Building 3, JinFeng Industry Area,  Fuyong Town, Baoan District, Shenzhen, Guangdong, 518103, China.

Tel : +86-136-3163-3671
Fax : +86-755-2301 2705
Email : [email protected]

Quick Links

  • Flexible PCB
  • Rigid Flex PCB
  • ELIC HDI PCB
  • RF PCB
  • PCB Capability
  • PCBA Capabiility
  • About Us

PCB Blog

The Future of Wearable Technology: Rigid-Flex PCB

Read More »

Electromagnetic Compatibility Design of Mobile Phone PCB (1)

Read More »

The PCB Circuit Design of LED Switching Power Supply

Read More »

© 2023 - XPCB Limited All Right Reserve