This must also depend on whether the part itself has a symbol indicating the polarity of the part, or the difference in appearance and shape can be implemented.
Severe warping can be judged by the difference in the brightness of light reflections, but slight warping can be somewhat difficult. Severe deformation can also be easily detected by using AOI. Slight warping must depend on the situation. This usually depends on the strictness of the parameter adjustment .
Generally speaking, the tin bridge is easy to check, but if it is a tin bridge hidden under the part, it is difficult to find. For example, the tin bridges of some connectors occur at the bottom of the component body. At this time, there is no way to detect it using AOI.
Therefore, the circuit board production line not only uses AOI to ensure its quality, but also use ICT (In-CircuitTest) and functional test (FVT) . Some production lines will add an additional AXI (AutomaticX-ray Inspection) , Use X-Ray to check the quality of the solder joints (such as BGA) under the components along the line.
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