Through-holes are one of the most common types of circuit boards, and the holes that can be seen by simply holding the PCB up to the light are called “through-holes” This is also the simplest kind of hole, because when making it, as long as you use a drill or laser to directly drill the circuit board, the cost is relatively cheap, but relatively, some circuit layers do not need to connect these through holes.
For example, we have a six-story house, I bought its third and fourth floors, I want to design a staircase in the interior only connect the third floor and the fourth floor, for me the space on the fourth floor is virtually connected to the first floor to the sixth floor of the stairs to use up some more space.
In order to increase the space utilization of the PCB circuit layer, the “blind hole” process came into being, and the production method needs to pay special attention to the depth of the drilling hole (Z-axis) to be just right. But this method often causes the difficulty of electroplating in the hole, so it is almost adopted by no manufacturer.
It is also possible to drill holes in advance for the circuit layers that need to be connected in individual circuit layers and then glue them together which requires more precise positioning and alignment devices.
The connection of any circuit layer inside the PCB board but not connected to the outer layer, the process can not be achieved by drilling after bonding. It must be drilled at the time of individual circuit layers, first partially glued to the inner layer and then electroplated first, and finally all bonded.
The production process is more labor-intensive than the previous two, so the manufacturing price is also the most expensive. This process is usually only used in high-density (HDI) circuit boards, to increase the usable space of other circuit layers.
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