From prototype to mass production stage，SMT chip processing need us to do a good job of preparation before production, to ensure that all materials can be smoothly on line, to avoid all kinds of break to look for material, because the production efficiency is the SMT chip processing plant’s lifeline is located. In order to do a good job of preparation before production, so that it is fully effective, to ensure timely completion, so the standard production process management is particularly important. The XPCB Limited will briefly describe the necessary preparation before SMT chip processing manufacturing.
1. According to the plan after the order is placed 4 hours in advance to arrange the preparation: stencil, jig audit, information, procedures, material special requirements trial samples to follow up and complete.
2. SMT production after the need to test the order, arrange to complete the finished product test the first finished product on the same day.
3.To test bad and function bad products 1 hour before production to give temporary operation plan, 1 day to give specific implementation of operational production measures.
SMT chip processing:
1. According to the plan order 4 hours in advance to elongate the arrangement of material receiving, preparation of materials.
2. 2 hours in advance before the technician turns to the line to confirm the stencil, jig, data (program) complete.
3. If the production line is short of material, the technician will be responsible for contacting the material officer and the department head will follow up to arrange for the material to be replenished within half an hour.
4. After the visual inspection of 5PCS, if the defect exceeds 5%, report to the technician and supervisor for analysis and treatment.
DIP plug-in handling：
1. Pullers arrange for helpers to pull and make the first part, quality and engineering confirmation 4 hours in advance of the planned order.
2. Determine auxiliary materials 4 hours in advance: overheating jigs, soldering jigs, tools, or customer-supplied jigs, etc.
3. Pre-production meeting (for each product) with a 3-5 minute explanation of process and quality.
4. When the test defect reaches 5%, production staff report to the director and supervisor; at the same time, engineering intervention analysis, within 1 hour to reply to the specific plan, production implementation, quality supervision is completed.
SMT placement production line
1. SMT first piece IPQC with the line production; DIP, IPQC to confirm the first piece inspection, to assist production completed 2 hours in advance.
2. Test& Assemble: production and engineering according to the plan order, 4 hours in advance to the quality, IPQC first piece confirmation, production online before 2 hours to complete
IV. Current process: All products to be tested and burned
New order – SMT – engineering trial first sample – DIP – test – assemble
Return order – SMT – DIP (production trial first sample) – test- assemble
V. New process (optimization)
1. Return order production following line burn-in and testing
Return order – SMT – AOI – DIP (production trial first sample) – test –assemble
2. After the order SMT placement, the same day all DIP first piece of material production preparation arrangements; welding, testing, assembly engineering lead arrangements.
New order – SMT – AOI – engineering trial first sample – DIP –Testing–assemble
XPCB Limited is a premium PCB & PCBA manufacturer based in China.
We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.
Quick-turn PCB prototyping is our specialty. Demanding project is our key capability.
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