Any PCB circuit board will be accompanied by a detailed description of the PCB surface treatment process. The choice of PCB surface treatment process has a direct impact on the product quotation. Of course, different process treatments have their advantages and disadvantages. The most important thing depends on where the product is applied. Let’s take a look at the common defects of PCB surface treatment process:
1. OSP Organic Anti-Oxidation:
It is very simply affected by acid and humidity. PCB storage time exceeds 3 months and needs to be re-surfaced processing treatment, used within 24 hours after opening the package. OSP is an insulating layer. It is sometimes necessary to print solder paste to process the original OSP layer at the test point before touching the pins for electrical testing.
2. Hot Air Leveling:
Pins with fine gaps and tiny components are not suitable for soldering. Because the PCB spray tin plate has poor surface flatness, and tin beads are prone to appear during PCB processing. It is easy to form a short circuit.
3. Chemically Immersed Silver:
Not only the cost is high when making PCB boards, but the welding performance is also not very good. Using the electroless nickel process, the black plate can be easily formed, and the nickel layer will also be oxidized constantly. Long-term reliability is also a problem.
4. Electroplating of Nickel Gold:
PCB board processed by electroplating of nickel gold, the color is slightly inferior to immersion gold. It is not as bright as other processes.
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