3. Copper pour near the crystal oscillator. The crystal oscillator in the circuit is a high-frequency emission source. The method is to pour copper around the crystal oscillator, and then ground the crystal oscillator separately.
4. The island (dead zone) problem, if you think it is too big, it won’t cost much to define a ground via and add it in.
5. At the beginning of the wiring, the ground wire should be treated the same. When routing the ground wire, the ground wire should be routed well. You cannot rely on adding vias to eliminate the ground pins for the connection after copper plating. This effect is very bad.
6. It is best not to have sharp corners on the board (<=180 degrees), because from the perspective of electromagnetics, this constitutes a transmitting antenna! There will always be an impact on others. I recommend using the edge of the arc.
7. Do not pour copper in the open area of the middle layer of the multilayer board. Because it is difficult for you to make this copper clad “good ground”.
8. The metal inside the device, such as metal radiators, metal reinforcement strips, must be “good grounding”.
9. The heat dissipation metal block of the three-terminal regulator must be well grounded. The ground isolation strip near the crystal oscillator must be well grounded. In short, if the grounding problem of the copper on the PCB is dealt with, it is definitely “pros outweigh the disadvantages”, it can reduce the return area of the signal line and reduce the electromagnetic interference of the signal to the outside.
Other related articles and PCB board design and production require certain technical content, so if you want to do this well, you need to use continuous learning and experience accumulation in order to slowly plan the strategy.
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