In the PCB board design, the design of the heat dissipation system includes the cooling method and the selection of heat dissipation components, as well as the consideration of the cold expansion coefficient. Nowadays, the commonly used methods of PCB board heat dissipation are heat dissipation through the PCB board, and adding a heat sink and a heat conduction board to the PCB board.
In the traditional PCB circuit board design, because the boards mostly use copper clad/epoxy glass cloth substrates or phenolic resin glass cloth substrates, and a small amount of paper-based copper clad boards, these materials have good electrical and processing properties, but the thermal conductivity is very poor. Since surface mount components such as QFP and BGA are used in large quantities in the current PCB board design, the heat generated by the components is transferred to the PCB board in a large amount. Therefore, the most effective way to solve the problem of heat dissipation is to improve the heat dissipation of the PCB board that is in direct contact with the heating element ability, transmitted or emitted through the PCB board.
When there are a few components on the PCB that generate a large amount of heat, a heat sink or a heat pipe can be added to the heating components of the PCB. When the temperature cannot be lowered, a heat sink with a fan can be used. When the amount of heating components on the PCB board is large, a large heat dissipation cover can be used, and the heat dissipation cover is buckled on the surface of the components as a whole, so that it contacts each component on the PCB board to dissipate heat. For professional computers used for video and animation production, it is even necessary to use water cooling for cooling.
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