What Kind Of Circuit Board Does The Sensor Need

A sensor is a detecting device that can sense the measured information and transform the perceived information into electrical signal or other information output in required forms according to certain rules, so as to meet the requirements of information transmission, processing, storage, display, recording and control.

By manufacturing process:

Integrated sensors are manufactured using standard manufacturing techniques for silicon-based semiconductor integrated circuits. Some of the circuits used to initially process the signals under test are also integrated on the same chip, such as the now much-developed MEMS sensors.

The thick film sensor is made by using the slurry of the corresponding material, coated on a ceramic substrate, which is usually made of Al2O3, and then heat-treated to form the thick film.

A thin film sensor is formed by depositing a thin film of the corresponding sensitive material on a dielectric substrate (substrate). When a hybrid process is used, part of the circuit may also be fabricated on the substrate.

Ceramic sensors using standard ceramic technology or some of its variant process (sol, gel, etc.) production. After proper preparatory operation, the formed elements are sintered at high temperatures.

There are many common characteristics between thick film and ceramic sensor. In some aspects, thick film technology can be considered as a variation of ceramic technology.

Select the sensor from the sensitivity, frequency response, linear range, stability and accuracy of these aspects to consider, the stability and the substrate has a great relationship, the first few mainly look at the manufacturing process, from the stability, then the most suitable for the sensor of the non-ceramic circuit board. The stability of ceramic materials is quite excellent, as long as the manufacturing process technology can pass, ceramic circuit board is undoubtedly better than other PCB.

Currently, the best manufacturing process of ceramic pcb should be LAM technology. Laser Activation Metallization (LAM technology) is used to combine ceramic and metal ions with high-energy Laser beam to firmly combine them.

However, at present, domestic (China) sensor manufacturers are mainly small and medium-sized, and many of them are still using thin film technology, using FR-4 substrate. The service life is not long, and the stability is poor. In case of a slightly worse environment, they will directly strike.

It will take a lot of work for sensors to catch up with international standards. But, XPCB can do this very professionally.

Sensor or ceramic PCB, at present, has been widely used in developed countries, the really not technology at present have restricted the development of our country, upgrading of sensor circuit board also depends on the mass-production factory, the factory for technical innovations, to become bigger and stronger, the sensor industry in our country and to catch up with the world.