With the overall transformation and upgrading of the domestic manufacturing industry, people have put forward higher requirements on the quality of PCB products in the PCB circuit board segmentation market. Traditional PCB board splitting equipment is mainly processed by cutting tools, milling cutter, and gong knife, which has more or fewer disadvantages such as dust, burr, and stress, etc. It has a great influence on the small PCB board or PCB board with components, and it is a little difficult in the new applications. The application of laser technology in PCB cutting provides a new solution for PCB splitter machining.
Advantages of laser-cut PCB include small cutting clearance, high precision, and small heat-affected area. Compared with traditional PCB cutting technology, laser-cut PCB is completely free of dust, stress, and burr, and its cutting edge is smooth and neat. But at present, the laser cutting PCB equipment has not been fully mature, and there are still obvious defects.
At present, the biggest defect of laser cutting PCB equipment lies in its low cutting speed. The thicker the cutting material is, the lower the cutting speed will be. Besides, the processing speed of different materials is also different to some extent. At the same time, the hardware cost of laser equipment itself is high, a laser cutting PCB equipment is about 2-3 times the price of traditional milling equipment, the higher the power, the more expensive the price, if three laser cutting PCB equipment can reach the speed of a milling cutter cutting PCB equipment, then the processing cost and labor cost will greatly increase. In addition, when the laser cuts thick materials such as PCB of more than 1mm, the cross-section will be carbonized, which is also the reason why many PCB manufacturers cannot accept laser cutting PCB.
In a word, the laser cutting PCB equipment in the current market has the disadvantages of high cost and low speed, which leads to the immature market, and it is only used by manufacturers with relatively high requirements, such as mobile PHONE PCB, automobile PCB, and medical PCB. However, with the continuous progress of laser technology, the improvement of laser power, the improvement of beam quality, and the upgrading of cutting technology, the stability of equipment will be gradually improved in the future, and the equipment cost will be lower and lower. The application of laser cutting in the PCB market in the future is worth looking forward to. It will be another growth point of the laser industry.
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