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PCB Layering Strategy

From the perspective of signal traces, a good PCB layering strategy should be to put all signal traces on one or several layers, and these layers are next to the power layer or ground layer. For the power supply, a good layering strategy should be that the power layer is adjacent to the ground layer, and the distance between the power layer and the ground layer is as small as possible. This is what we call the “layering” strategy.

A good PCB layering strategy is as follows:

1. The projection plane of the wiring layer should be in its reflow plane layer area. If the PCB wiring layer is not in the projection area of ​​the reflow plane layer, there will be signal lines outside the projection area during wiring, which will cause “edge radiation” problems, and will also increase the area of ​​the signal loop, resulting in increased differential mode radiation. 

2. Try to avoid setting up adjacent wiring layers. Because parallel signal traces on adjacent wiring layers can cause signal crosstalk, if it is unavoidable that the wiring layers are adjacent, the layer spacing between the two wiring layers should be appropriately increased, and the layer spacing between the wiring layer and its signal loop should be reduced.

3. Adjacent plane layers should avoid overlapping of their projection planes. Because when the projections overlap, the coupling capacitance between the layers will cause the noise between the layers to couple with each other.

As a professional FPC soft board manufacturer, XPCB Limited is so honored to have worked together with many of you. At XPCB Limited we are always more than ready to assist our new customers in any way we can.  Please feel free to contact us at any time if you have any questions.

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Company Info

XPCB Limited is a premium PCB & PCBA manufacturer based in China.

We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.

Quick-turn PCB prototyping is our specialty.  Demanding project is our advantage.

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XPCB Limited
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Tel : +86-136-3163-3671
Fax : +86-755-2301 2705
Email : [email protected]

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Multilayer PCB Assembly and HDI PCB Manufacturing for High-Tech Solutions

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