Analysis of The Causes of Circuit Board Disconnection

First look at the form of the disconnection, then analyze the process in which the disconnection is made, and then analyze the cause of the process in that process. Then check it step by step.

Generally, the disconnection problem is mainly in the filming process. (The reason is that the film is not firmly attached, there are bubbles, and if it is a wet film, there will be garbage pollution.), the exposure process (the film is caused by scratches or garbage, including problems with the exposure machine, insufficient exposure, etc. ), development process (unclear development), etching process (excessive nozzle pressure, too long etching time), plating problems (uneven plating, or adsorption on the surface), improper operation (basically caused by scratches).

The key depends on the form of disconnection, so process engineer experience is very important.

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