Common Problems in the Surface Treatment of OSP PCB Circuit Board

In the production of PCB circuit boards, there are also many options for surface treatment, such as: Immersion gold, Immersion silver, spray tin (lead-free and lead-free), OSP, etc., and their prices and production processes will also be slightly different. Yes, today I will take a look at the surface treatment OSP

1. OSP PCB Circuit Board Production Requirements

a.) After all the PCB circuit boards are produced, they must be vacuum packed, with desiccant and humidity display card attached. Secondly, it should not be directly exposed to sunlight, and a good storage environment should be maintained. Relative humidity: 30～70%, temperature: 15～30℃, and the shelf life is generally about 6 months.

b.) During the production process, we must avoid touching the surface of the PCB circuit board with our hands directly to prevent the surface from being oxidized, so we must wear gloves to operate.

c.) The damp OSP PCB circuit board cannot be baked and used. High-temperature baking can easily cause discoloration and deterioration of OSP.

2. OSP PCB Circuit Board Printing Solder Paste Poor Board Processing Requirements

a.) Workers try to avoid printing errors when printing solder paste because the OSP protective layer will be damaged during cleaning.

b.) When the solder paste printed on the PCB circuit board is not good, because the OSP protective film is easily corroded by organic solvents, all PCB circuit boards cannot be soaked or cleaned with high volatile solvents, and the solder paste can be wiped off with a non-woven cloth dipped in 75% alcohol. Blow-dry in time with an air gun. Do not use isopropyl alcohol (IPA) for cleaning, and must not use a stirring knife to scrape off the solder paste on the poorly printed board.

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