When considering the performance characteristics of the printed circuit board PCB substrate, the mechanical properties (especially how the material should be performed during thermal cycling/soldering operations) and the electrical properties related to the material should be considered. These are generally considered to be the most common factors for selecting standard products.
· CTE-Z axis (Coefficient of Thermal Expansion): This is an index to measure the degree of expansion of the substrate when heated. It is measured as PPM/°C (before and after Tg) and% within a certain temperature range.
· Td (Decomposition Temperature): This is the temperature at which the weight of the printed circuit board PCB material changes by 5%. This parameter determines the thermal viability of the material.
· Tg (Glass Transition Temperature): The temperature at which a material ceases to function, such as a rigid material, which begins to behave like plastic/softer.
· T260 (Delamination Time): This is the time required for the substrate to delamination at a temperature of 260°C. · T288 (delamination time): This is the time required for the substrate to delaminate at a temperature of 288 degrees Celsius.
· Dk (Dielectric Constant): The ratio of the capacitance using this material as a dielectric to a similar capacitor with a vacuum as its dielectric.
· CTI (Comparative Tracking Index): A measure of the electrical breakdown characteristics of the insulated printed circuit board PCB material. It is used for the electrical safety assessment of electrical equipment.
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