Under the premise of cost permitting, increasing the number of grounding layers and placing the signal layer close to the grounding layer can reduce EMI radiation. For high-speed PCBs, the power plane and ground plane are closely coupled, which can reduce the power supply impedance, thereby reducing EMI.
According to the signal current flow, a reasonable layout can reduce the interference between signals. Reasonable layout is the key to controlling EMI. The basic principles of the layout are:
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