High-current, high-power circuits should be avoided as far as possible in the central area of the board, and the effects of heat dissipation and radiation should be considered;
The connector should be arranged on one side of the board as far as possible and far away from the high-frequency circuit;
The input/output circuit is close to the corresponding connector, and the decoupling capacitor is close to the corresponding power pin;
Fully consider the feasibility of the layout for power supply division, and multi-power devices should be placed across the boundary of the power supply division area to effectively reduce the impact of plane division on EMI;
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