During the welding process In the selection process of the viscosity performance of the patch adhesive, it is necessary to fully realize that the viscosity is the basic substance that ensures the patch adhesive play the connection between the printed board and the patch. Therefore, the selection of patch adhesives with appropriate viscosity is the core component of the entire patch adhesive selection process. Specifically, in the process of SMT manual soldering, the specific viscosity performance of the patch adhesive within the temperature range is investigated through the investigation and study of the temperature points of the manual soldering process.
At the same time, in the selection process of the patch adhesive, it is necessary to fully consider the viscosity performance of the patch adhesive under different pressures and temperatures, so as to ensure that the high temperature and high-pressure environment exist in the welding process can be ensured. The patch adhesive can still maintain its own viscosity performance to ensure the normal use of electronic products. In the research and selection process of the coating performance of the patch adhesive during the welding process, it is necessary to fully realize that the coating operation of the SMT manual soldering patch mainly refers to the selection of the appropriate transfer method and the dip-coating method. Through the inquiry of relevant data and literature, it can be found that in order to ensure the normal coating effect, the diameter value of the selected patch glue and the height of the glue dot formed on the printed board are required to be controlled within a certain range of values. In turn, the high-quality completion of the entire welding and bonding process is ensured.
In order to prevent the detachment of electronic components due to external forces in the subsequent manual soldering process, it is required to investigate and study the shear stress performance of the patch adhesive during the selection process of the patch adhesive.
Specifically, the performance requirements for the electronic printed boards and the connection parts of the electronic components used in the SMT manual soldering patch adhesive are relatively high. In this context, in the selection process of the corresponding patch adhesive, it is necessary to pay full attention to the analysis of shear stress and the analysis and research of the pasting method to ensure that the selected patch adhesive can meet the actual conditions of the SMT soldering and pasting process.
Therefore, in the selection and evaluation of the SMT adhesive in the application of SMT manual welding, it is necessary to fully consider the impact of various performance factors of the adhesive on the welding process, and in the selection process of the adhesive, In response to the actual needs of printed board welding processing, the SMT adhesives with excellent performance and meeting processing needs are screened out.
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